Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
---|
FM25160-S | 16Kb FRAM serial memory. | distributor | SOP | 8 | -40°C | 85°C | 638 K |
FM25C160-P | 16Kb FRAM serial memory. | distributor | plastic DIP | 8 | -40°C | 85°C | 101 K |
FM25C160-S | 16Kb FRAM serial memory. | distributor | SOP | 8 | -40°C | 85°C | 101 K |
M35060-XXXSP | Screen character and pattern display controller | Mitsubishi-Electric-Corporation-Semiconductor-Group | Plastic SDIP | 32 | -20°C | 70°C | 260 K |
M5LV-512/160-12YI | 12ns fifth generation MACH architecture CPLD (Complex Programmable Logic Device) | Lattice-Semiconductor-Corporation | PQFP | 100 | -40°C | 85°C | 1 M |
M5LV-512/160-15YI | 15ns fifth generation MACH architecture CPLD (Complex Programmable Logic Device) | Lattice-Semiconductor-Corporation | PQFP | 100 | -40°C | 85°C | 1 M |
M5LV-512/160-20YI | 20ns fifth generation MACH architecture CPLD (Complex Programmable Logic Device) | Lattice-Semiconductor-Corporation | PQFP | 100 | -40°C | 85°C | 1 M |
PM15CTM060-3 | 15A intelligent power module for flat-base type | Mitsubishi-Electric-Corporation-Semiconductor-Group | Insulated package | 20 | -20°C | 125°C | 139 K |
PM20CTM060-3 | 20A intelligent power module for flat-base type | Mitsubishi-Electric-Corporation-Semiconductor-Group | Insulated package | 20 | -20°C | 125°C | 137 K |
PM30CTJ060-3 | 30A intelligent power module for flat-base type | Mitsubishi-Electric-Corporation-Semiconductor-Group | Insulated package | 20 | -20°C | 125°C | 136 K |
<< [32] [33] [34] [35] [36] 37 [38] [39] [40] [41] [42] >> |
---|