| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| LLE16045X | NPN microwave power transistor | Philips-Semiconductors | SOT | 3 | - | - | 79 K |
| LLE16045X | NPN microwave power transistor | Philips-Semiconductors | SOT | 3 | - | - | 79 K |
| MI-PC604-XXX | InputV:270V; outputV:5V; 200-300W; complete dual output DC-DC power military supply | distributor | - | - | - | - | 150 K |
| MI-RC604X-XXXX | InputV:270V; outputV:5V; 150-300W; 30-..A; complete triple output DC-DC power military supply | distributor | - | - | - | - | 150 K |
| N74F604D | 5.5 V, dual octal latch | Philips-Semiconductors | SOL | 28 | 0°C | 70°C | 53 K |
| N74F604N | 5.5 V, dual octal latch | Philips-Semiconductors | DIP | 28 | 0°C | 70°C | 53 K |
| RD28F1604C3B110 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,110ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F1604C3BD70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F1604C3T110 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,110ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F1604C3T110 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,110ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F1604C3TD70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
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