| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| ACM1604C-NLBH-T | 2.7-5.5V; 16characters x 4lines; dot size:0.55x0.55mm; dot pitch:0.60x0.60mm; liquid crystal display | distributor | - | - | -20°C | 70°C | 288 K |
| ACM1604C-NLBW-T | 2.7-5.5V; 16characters x 4lines; dot size:0.55x0.55mm; dot pitch:0.60x0.60mm; liquid crystal display | distributor | - | - | -20°C | 70°C | 288 K |
| ACM1604C-NLYH-T | 2.7-5.5V; 16characters x 4lines; dot size:0.55x0.55mm; dot pitch:0.60x0.60mm; liquid crystal display | distributor | - | - | -20°C | 70°C | 288 K |
| ACM1604C-NLYW-T | 2.7-5.5V; 16characters x 4lines; dot size:0.55x0.55mm; dot pitch:0.60x0.60mm; liquid crystal display | distributor | - | - | -20°C | 70°C | 288 K |
| RD28F1604C3B110 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,110ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F1604C3B90 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 90ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F1604C3BD70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F1604C3T110 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,110ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F1604C3T110 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,110ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F1604C3TD70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
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