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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
5962-9960601QUA512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish hot solder dipped. Total dose none.distributorCeramic flatpack32-55°C125°C107 K
5962-9960601QUC512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish gold. Total dose none.distributorCeramic flatpack32-55°C125°C107 K
5962-9960601QUX512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish factory optional. Total dose none.distributorCeramic flatpack32-55°C125°C107 K
5962-9960601QUX512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish factory optional. Total dose none.distributorCeramic flatpack32-55°C125°C107 K
5962D9960601QUA512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).distributorCeramic flatpack32-55°C125°C107 K
5962D9960601QUC512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish gold. Total dose 1E4(10krad(Si)).distributorCeramic flatpack32-55°C125°C107 K
5962D9960601QUX512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish factory option. Total dose 1E4(10krad(Si)).distributorCeramic flatpack32-55°C125°C107 K
5962P9960601QUA512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).distributorCeramic flatpack32-55°C125°C107 K
5962P9960601QUX512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish factory option. Total dose 3E4(30krad(Si)).distributorCeramic flatpack32-55°C125°C107 K
5962P9960601TUX512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish factory option. Total dose 3E4(30krad(Si)).distributorCeramic flatpack32-55°C125°C107 K
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