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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
5962L9960701TUA512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 5E4(50krad)(Si)distributorCeramic flatpack36-55°C125°C127 K
5962L9960701TUA512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 5E4(50krad)(Si)distributorCeramic flatpack36-55°C125°C127 K
5962L9960702TUA512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 5E4(50krad)(Si)distributorCeramic flatpack36-40°C125°C127 K
5962L9960703TUA512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 5E4(50krad)(Si)distributorCeramic flatpack36-55°C125°C127 K
5962L9960703TXX512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 5E4(50krad)(Si)distributorFlatpack shielded36-55°C125°C127 K
5962L9960703TXX512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 5E4(50krad)(Si)distributorFlatpack shielded36-55°C125°C127 K
5962L9960703TXX512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 5E4(50krad)(Si)distributorFlatpack shielded36-55°C125°C127 K
5962L9960704TUA512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 5E4(50krad)(Si)distributorCeramic flatpack36-40°C125°C127 K
5962L9960704TUA512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 5E4(50krad)(Si)distributorCeramic flatpack36-40°C125°C127 K
5962L9960704TXX512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 5E4(50krad)(Si)distributorFlatpack shielded36-40°C125°C127 K
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