| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| A80960CA-16 | 32-bit high-performanc embedded processor 16MHz | Intel-Corporation | PGA | 168 | 0°C | 100°C | 977 K |
| A80960CA-25 | 32-bit high-performanc embedded processor 25MHz | Intel-Corporation | PGA | 168 | 0°C | 100°C | 977 K |
| A80960CA-33 | 32-bit high-performanc embedded processor 33MHz | Intel-Corporation | PGA | 168 | 0°C | 100°C | 977 K |
| A80960CF-40 | 32-bit high-performance superscalar embedded microprocessor | Intel-Corporation | Ceramic PGA | 168 | 0°C | 85°C | 1 M |
| KU80960CA-33 | 32-bit high-performanc embedded processor 33MHz | Intel-Corporation | PQFP | 196 | 0°C | 100°C | 977 K |
| TA80960CA-16 | 32-Bit high-performance embedded processor | Intel-Corporation | Ceramic PGA | 168 | -40°C | 110°C | 1 M |
| TA80960CA-25 | 32-Bit high-performance embedded processor | Intel-Corporation | Ceramic PGA | 168 | -40°C | 110°C | 1 M |
| TA80960CF-16 | 32-Bit high-performance superscalar processor | Intel-Corporation | Ceramic PGA | 168 | -40°C | 110°C | 1 M |
| TA80960CF-25 | 32-Bit high-performance superscalar processor | Intel-Corporation | Ceramic PGA | 168 | -40°C | 110°C | 1 M |
| TA80960CF-30 | 32-Bit high-performance superscalar processor | Intel-Corporation | Ceramic PGA | 168 | -40°C | 110°C | 1 M |
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