Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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DMC60C32 | CMOS single component 8-bit microcomputer | Daewoo-Semiconductor | DIP | 40 | 0°C | 70°C | 706 K |
GT28F160C3B90 | 3 volt advanced + boot block flash memory 16 Mbit. Access speed 90 ns | Intel-Corporation | microBGA | 48 | -40°C | 85°C | 384 K |
GT28F160C3T110 | 3 volt advanced + boot block flash memory 16 Mbit. Access speed 110 ns | Intel-Corporation | microBGA | 48 | -40°C | 85°C | 384 K |
GT28F160C3T90 | 3 volt advanced + boot block flash memory 16 Mbit. Access speed 90 ns | Intel-Corporation | microBGA | 48 | -40°C | 85°C | 384 K |
TE28F160C3B110 | 3 volt advanced + boot block flash memory 16 Mbit. Access speed 110 ns | Intel-Corporation | TSOP | 48 | -40°C | 85°C | 384 K |
TE28F160C3B90 | 3 volt advanced + boot block flash memory 16 Mbit. Access speed 90 ns | Intel-Corporation | TSOP | 48 | -40°C | 85°C | 384 K |
TE28F160C3B90 | 3 volt advanced + boot block flash memory 16 Mbit. Access speed 90 ns | Intel-Corporation | TSOP | 48 | -40°C | 85°C | 384 K |
TE28F160C3T110 | 3 volt advanced + boot block flash memory 16 Mbit. Access speed 110 ns | Intel-Corporation | TSOP | 48 | -40°C | 85°C | 384 K |
TE28F160C3T110 | 3 volt advanced + boot block flash memory 16 Mbit. Access speed 110 ns | Intel-Corporation | TSOP | 48 | -40°C | 85°C | 384 K |
TE28F160C3T90 | 3 volt advanced + boot block flash memory 16 Mbit. Access speed 90 ns | Intel-Corporation | TSOP | 48 | -40°C | 85°C | 384 K |
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