Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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DDU18-160C3 | 8-TAP, ECL-interfaced fixed delay line | distributor | SMD | 24 | 0°C | 85°C | 44 K |
GT28F160C3B110 | 3 volt advanced + boot block flash memory 16 Mbit. Access speed 110 ns | Intel-Corporation | microBGA | 48 | -40°C | 85°C | 384 K |
HGT1S3N60C3DS | TRANSISTOR.IGBT TO-263 | Fairchild-Semiconductor | - | - | - | - | 327 K |
HGT1S7N60C3DS | TRANSISTOR.IGBT TO-263 | Fairchild-Semiconductor | - | - | - | - | 197 K |
HGTD3N60C3S | TRANSISTOR IGBT TO-252 | Fairchild-Semiconductor | - | - | - | - | 227 K |
HGTP20N60C3R | TRANSISTOR IGBT TO-262 | Fairchild-Semiconductor | - | - | - | - | 107 K |
MDU12H-60C3 | Delay 60 +/-6 ns, dual, ECL-interfaced fixed delay line | distributor | SMD | 16 | -30°C | 85°C | 36 K |
MT28F160C34FD-9TET | 1Meg x 16; 3V enhanced + boot bolck flash memory | distributor | FBGA | 46 | -40°C | 85°C | 341 K |
MT28F160C3FD-11TET | 1Meg x 16; 3V enhanced + boot bolck flash memory | distributor | FBGA | 46 | -40°C | 85°C | 341 K |
MT28F160C3FD-9TET | 1Meg x 16; 3V enhanced + boot bolck flash memory | distributor | FBGA | 46 | -40°C | 85°C | 341 K |
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