Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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IDT72261L10TF | CMOS supersync FIFO 16,384 x 9, 768 x 9 | Integrated-Device-Technology-Inc- | STQFP | 64 | 0°C | 70°C | 388 K |
IDT72261L12TF | CMOS supersync FIFO 16,384 x 9, 768 x 9 | Integrated-Device-Technology-Inc- | STQFP | 64 | 0°C | 70°C | 388 K |
IDT72261L15PF | CMOS supersync FIFO 16,384 x 9, 768 x 9 | Integrated-Device-Technology-Inc- | TQFP | 64 | 0°C | 70°C | 388 K |
IDT72261L15PFB | CMOS supersync FIFO 16,384 x 9, 768 x 9 | Integrated-Device-Technology-Inc- | TQFP | 64 | -55°C | 125°C | 388 K |
IDT72261L15TF | CMOS supersync FIFO 16,384 x 9, 768 x 9 | Integrated-Device-Technology-Inc- | STQFP | 64 | 0°C | 70°C | 388 K |
IDT72261L15TFB | CMOS supersync FIFO 16,384 x 9, 768 x 9 | Integrated-Device-Technology-Inc- | STQFP | 64 | -55°C | 125°C | 388 K |
IDT72261L20PF | CMOS supersync FIFO 16,384 x 9, 768 x 9 | Integrated-Device-Technology-Inc- | TQFP | 64 | 0°C | 70°C | 388 K |
IDT72261L25PFB | CMOS supersync FIFO 16,384 x 9, 768 x 9 | Integrated-Device-Technology-Inc- | TQFP | 64 | -55°C | 125°C | 388 K |
IDT72261L25TFB | CMOS supersync FIFO 16,384 x 9, 768 x 9 | Integrated-Device-Technology-Inc- | STQFP | 64 | -55°C | 125°C | 388 K |
W91561LN | 3-memory tone/pulse dialer with keytone, lock and handfee functions | Winbond-Electronics | DIP18 | 18 | 0°C | 70°C | 220 K |
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