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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
M66220FP256 x 8-bit mail-boxMitsubishi-Electric-Corporation-Semiconductor-GroupDIP42-20°C75°C138 K
M66220SP256 x 8-bit mail-boxMitsubishi-Electric-Corporation-Semiconductor-GroupDIP42-20°C75°C138 K
M66221FP256 x 9-bit mail-boxMitsubishi-Electric-Corporation-Semiconductor-GroupDIP52-20°C75°C119 K
M66221SP256 x 9-bit mail-boxMitsubishi-Electric-Corporation-Semiconductor-GroupDIP48-20°C75°C119 K
M66222FP128 x 8-bit x 2 mail-boxMitsubishi-Electric-Corporation-Semiconductor-GroupDIP42-20°C75°C111 K
M66222SP128 x 8-bit x 2 mail-boxMitsubishi-Electric-Corporation-Semiconductor-GroupDIP42-20°C75°C111 K
ORT4622BC432ORCA feild-programmable system chip four-channel x 622 Mbits/s backplane transceiverdistributorEBGA4320°C70°C1 M
ORT4622BC432IORCA feild-programmable system chip four-channel x 622 Mbits/s backplane transceiverdistributorEBGA432-40°C85°C1 M
ORT4622BM432ORCA feild-programmable system chip four-channel x 622 Mbits/s backplane transceiverdistributorPBGAM6800°C70°C1 M
ORT4622BM432IORCA feild-programmable system chip four-channel x 622 Mbits/s backplane transceiverdistributorPBGAM680-40°C85°C1 M
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