Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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M66220FP | 256 x 8-bit mail-box | Mitsubishi-Electric-Corporation-Semiconductor-Group | DIP | 42 | -20°C | 75°C | 138 K |
M66220SP | 256 x 8-bit mail-box | Mitsubishi-Electric-Corporation-Semiconductor-Group | DIP | 42 | -20°C | 75°C | 138 K |
M66221FP | 256 x 9-bit mail-box | Mitsubishi-Electric-Corporation-Semiconductor-Group | DIP | 52 | -20°C | 75°C | 119 K |
M66221SP | 256 x 9-bit mail-box | Mitsubishi-Electric-Corporation-Semiconductor-Group | DIP | 48 | -20°C | 75°C | 119 K |
M66222FP | 128 x 8-bit x 2 mail-box | Mitsubishi-Electric-Corporation-Semiconductor-Group | DIP | 42 | -20°C | 75°C | 111 K |
M66222SP | 128 x 8-bit x 2 mail-box | Mitsubishi-Electric-Corporation-Semiconductor-Group | DIP | 42 | -20°C | 75°C | 111 K |
ORT4622BC432 | ORCA feild-programmable system chip four-channel x 622 Mbits/s backplane transceiver | distributor | EBGA | 432 | 0°C | 70°C | 1 M |
ORT4622BC432I | ORCA feild-programmable system chip four-channel x 622 Mbits/s backplane transceiver | distributor | EBGA | 432 | -40°C | 85°C | 1 M |
ORT4622BM432 | ORCA feild-programmable system chip four-channel x 622 Mbits/s backplane transceiver | distributor | PBGAM | 680 | 0°C | 70°C | 1 M |
ORT4622BM432I | ORCA feild-programmable system chip four-channel x 622 Mbits/s backplane transceiver | distributor | PBGAM | 680 | -40°C | 85°C | 1 M |
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