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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
5962H3829435BNARadiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class Q. Lead finish solder.distributorFlatPack28-55°C125°C100 K
5962H3829435BNARadiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class Q. Lead finish solder.distributorFlatPack28-55°C125°C100 K
5962H9475408QLARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish solder.distributorDIP24-55°C125°C287 K
5962H9475408QLARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish solder.distributorDIP24-55°C125°C287 K
5962H9475408QLXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional.distributorDIP24-55°C125°C287 K
5962H9475408QLXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional.distributorDIP24-55°C125°C287 K
5962H9475408QXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish solder.distributorFlatPack24-55°C125°C287 K
5962H9475408QXCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish gold.distributorFlatPack24-55°C125°C287 K
5962H9475408QXXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional.distributorFlatPack24-55°C125°C287 K
5962H9475408QXXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional.distributorFlatPack24-55°C125°C287 K
5962H9475408QYARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish solder.distributorQuad flatpack28-55°C125°C287 K
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