Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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5962P0053601QUA | 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)). | distributor | Ceramic flatpack | 36 | -55°C | 125°C | 128 K |
5962P0053601QUA | 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)). | distributor | Ceramic flatpack | 36 | -55°C | 125°C | 128 K |
5962P0053601QUA | 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)). | distributor | Ceramic flatpack | 36 | -55°C | 125°C | 128 K |
5962P0053602QXA | 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)). | distributor | Flatpack shielded | 36 | -40°C | 125°C | 128 K |
5962P0053602TUX | 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 3E4(30krad(Si)). | distributor | Ceramic flatpack | 36 | -40°C | 125°C | 128 K |
5962P0053602TUX | 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 3E4(30krad(Si)). | distributor | Ceramic flatpack | 36 | -40°C | 125°C | 128 K |
5962P0053603QXA | 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)). | distributor | Flatpack shielded | 36 | -55°C | 125°C | 128 K |
5962P0053603QXA | 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)). | distributor | Flatpack shielded | 36 | -55°C | 125°C | 128 K |
5962P0053603TUX | 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 3E4(30krad(Si)). | distributor | Ceramic flatpack | 36 | -55°C | 125°C | 128 K |
5962P0053604QXA | 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)). | distributor | Flatpack shielded | 36 | -40°C | 125°C | 128 K |
5962P0053604TUX | 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 3E4(30krad(Si)). | distributor | Ceramic flatpack | 36 | -40°C | 125°C | 128 K |
5962P0053604TUX | 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 3E4(30krad(Si)). | distributor | Ceramic flatpack | 36 | -40°C | 125°C | 128 K |
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