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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
28C256APC-1High speed CMOS. 256K electrically erasable programmable ROM. 32K x 8 bit EEPROM. Access time 120 ns.distributorPDIP280°C70°C41 K
28C256APC-2High speed CMOS. 256K electrically erasable programmable ROM. 32K x 8 bit EEPROM. Access time 150 ns.distributorPDIP280°C70°C41 K
28C256APC-3High speed CMOS. 256K electrically erasable programmable ROM. 32K x 8 bit EEPROM. Access time 200 ns.distributorPDIP280°C70°C41 K
28C256APC-4High speed CMOS. 256K electrically erasable programmable ROM. 32K x 8 bit EEPROM. Access time 250 ns.distributorPDIP280°C70°C41 K
28C256API-1High speed CMOS. 256K electrically erasable programmable ROM. 32K x 8 bit EEPROM. Access time 120 ns.distributorPDIP28-40°C85°C41 K
28C256API-2High speed CMOS. 256K electrically erasable programmable ROM. 32K x 8 bit EEPROM. Access time 150 ns.distributorPDIP28-40°C85°C41 K
28C256API-3High speed CMOS. 256K electrically erasable programmable ROM. 32K x 8 bit EEPROM. Access time 200 ns.distributorPDIP28-40°C85°C41 K
EM6A9320BI-3.5285MHz 2.8V 4M x 32 DDR SDRAMdistributorFBGA1440°C70°C610 K
EM6A9320BI-4250MHz 2.5V 4M x 32 DDR SDRAMdistributorFBGA1440°C70°C610 K
EM6A9320BI-5200MHz 2.5V 4M x 32 DDR SDRAMdistributorFBGA1440°C70°C610 K
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