| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| AM29LV004B-70REC | 4 megabit CMOS 3.0 volt-only boot sector flash memory | AMD-Advanced-Micro-Devices | TSOP | 40 | 0°C | 70°C | 455 K |
| AM29LV004B-70RECB | 4 megabit CMOS 3.0 volt-only boot sector flash memory | AMD-Advanced-Micro-Devices | TSOP | 40 | 0°C | 70°C | 455 K |
| AS29LV800B-70RTI | 3V 1M x 8/512K x 16 CMOS flash EEPROM, 70ns access time | Alliance-Semiconductor-Corporation | TSOP | 48 | -40°C | 85°C | 463 K |
| AS29LV800T-70RSC | 3V 1M x 8/512K x 16 CMOS flash EEPROM, 70ns access time | Alliance-Semiconductor-Corporation | SO | 44 | 0°C | 70°C | 463 K |
| AS29LV800T-70RSI | 3V 1M x 8/512K x 16 CMOS flash EEPROM, 70ns access time | Alliance-Semiconductor-Corporation | SO | 44 | -40°C | 85°C | 463 K |
| AS29LV800T-70RTC | 3V 1M x 8/512K x 16 CMOS flash EEPROM, 70ns access time | Alliance-Semiconductor-Corporation | TSOP | 48 | 0°C | 70°C | 463 K |
| AS29LV800T-70RTI | 3V 1M x 8/512K x 16 CMOS flash EEPROM, 70ns access time | Alliance-Semiconductor-Corporation | TSOP | 48 | -40°C | 85°C | 463 K |
| PAC470R4GQ | High performance bus termination network | California-Micro-Devices | QSOP | 24 | 0°C | 70°C | 87 K |
| PAC470R6GQ | EMI/RTIT-filter | California-Micro-Devices | QSOP | 24 | 0°C | 70°C | 99 K |
| PAC470RGQ | P/active high performance GTL/ECL local termination ntework | California-Micro-Devices | QSOP | 24 | 0°C | 70°C | 88 K |
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