Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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IDT72105L25SO | CMOS parallel-to-serial fifo 256x16, 512x16, 1024x16 | Integrated-Device-Technology-Inc- | SOIC | 28 | 0°C | 70°C | 179 K |
IDT72105L25TP | CMOS parallel-to-serial fifo 256x16, 512x16, 1024x16 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 179 K |
IDT72105L50SO | CMOS parallel-to-serial fifo 256x16, 512x16, 1024x16 | Integrated-Device-Technology-Inc- | SOIC | 28 | 0°C | 70°C | 179 K |
IDT72105L50TP | CMOS parallel-to-serial fifo 256x16, 512x16, 1024x16 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 179 K |
IDT72115L25SO | CMOS parallel-to-serial fifo 256x16, 512x16, 1024x16 | Integrated-Device-Technology-Inc- | SOIC | 28 | 0°C | 70°C | 179 K |
IDT72115L25TP | CMOS parallel-to-serial fifo 256x16, 512x16, 1024x16 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 179 K |
IDT72115L50SO | CMOS parallel-to-serial fifo 256x16, 512x16, 1024x16 | Integrated-Device-Technology-Inc- | SOIC | 28 | 0°C | 70°C | 179 K |
IDT72115L50TP | CMOS parallel-to-serial fifo 256x16, 512x16, 1024x16 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 179 K |
IDT72125L25SO | CMOS parallel-to-serial fifo 256x16, 512x16, 1024x16 | Integrated-Device-Technology-Inc- | SOIC | 28 | 0°C | 70°C | 179 K |
IDT72125L25TP | CMOS parallel-to-serial fifo 256x16, 512x16, 1024x16 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 179 K |
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