Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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IDT72103L35J | CMOS parallel-serial FIFO 2048 x 9, 4096 x 9 | Integrated-Device-Technology-Inc- | PLCC | 40 | 0°C | 70°C | 314 K |
IDT72103L50J | CMOS parallel-serial FIFO 2048 x 9, 4096 x 9 | Integrated-Device-Technology-Inc- | PLCC | 40 | 0°C | 70°C | 314 K |
IDT72104L35J | CMOS parallel-serial FIFO 2048 x 9, 4096 x 9 | Integrated-Device-Technology-Inc- | PLCC | 40 | 0°C | 70°C | 314 K |
IDT72104L50J | CMOS parallel-serial FIFO 2048 x 9, 4096 x 9 | Integrated-Device-Technology-Inc- | PLCC | 40 | 0°C | 70°C | 314 K |
IDT72131L35P | CMOS parallel-to-serial FIFO 2048 x 9, 4096 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 126 K |
IDT72132L35P | CMOS sreial-to-parallel FIFO 2048 x 9, 4096 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 137 K |
IDT72141L35P | CMOS parallel-to-serial FIFO 2048 x 9, 4096 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 126 K |
IDT72141L50P | CMOS parallel-to-serial FIFO 2048 x 9, 4096 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 126 K |
IDT72142L35P | CMOS sreial-to-parallel FIFO 2048 x 9, 4096 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 137 K |
IDT72142L50P | CMOS sreial-to-parallel FIFO 2048 x 9, 4096 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 137 K |
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