Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
---|
IDT72605L20G | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | PGA | 68 | 0°C | 70°C | 209 K |
IDT72605L25G | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | PGA | 68 | 0°C | 70°C | 209 K |
IDT72605L35G | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | PGA | 68 | 0°C | 70°C | 209 K |
IDT72605L50G | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | PGA | 68 | 0°C | 70°C | 209 K |
IDT72615L20G | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | PGA | 68 | 0°C | 70°C | 209 K |
IDT72615L20J | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | PLCC | 68 | 0°C | 70°C | 209 K |
IDT72615L25G | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | PGA | 68 | 0°C | 70°C | 209 K |
IDT72615L35G | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | PGA | 68 | 0°C | 70°C | 209 K |
IDT72615L35J | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | PLCC | 68 | 0°C | 70°C | 209 K |
IDT72615L50J | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | PLCC | 68 | 0°C | 70°C | 209 K |
<< [9] [10] [11] [12] [13] 14 [15] [16] [17] [18] [19] >> |
---|