| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| IDT72V3660L10PF | 3.3V, high-density, low power, 4096 x 36-bit FIFO, 10ns | Integrated-Device-Technology-Inc- | TQFP | 128 | 0°C | 70°C | 567 K |
| IDT72V3660L15PF | 3.3V, high-density, low power, 4096 x 36-bit FIFO, 15ns | Integrated-Device-Technology-Inc- | TQFP | 128 | 0°C | 70°C | 567 K |
| IDT72V3660L15PFI | 3.3V, high-density, low power, 4096 x 36-bit FIFO, 15ns | Integrated-Device-Technology-Inc- | TQFP | 128 | -40°C | 85°C | 567 K |
| IDT72V3670L10PF | 3.3V, high-density, low power, 8192 x 36-bit FIFO, 10ns | Integrated-Device-Technology-Inc- | TQFP | 128 | 0°C | 70°C | 567 K |
| IDT72V3670L15PF | 3.3V, high-density, low power, 8192 x 36-bit FIFO, 15ns | Integrated-Device-Technology-Inc- | TQFP | 128 | 0°C | 70°C | 567 K |
| IDT72V3670L15PFI | 3.3V, high-density, low power, 8192 x 36-bit FIFO, 15ns | Integrated-Device-Technology-Inc- | TQFP | 128 | -40°C | 85°C | 567 K |
| IDT72V3670L7.5PF | 3.3V, high-density, low power, 8192 x 36-bit FIFO, 7.5ns | Integrated-Device-Technology-Inc- | TQFP | 128 | 0°C | 70°C | 567 K |
| IDT72V3680L7.5PF | 3.3V, high-density, low power, 16384 x 36-bit FIFO, 7.5ns | Integrated-Device-Technology-Inc- | TQFP | 128 | 0°C | 70°C | 567 K |
| IDT72V3690L10PF | 3.3V, high-density, low power, 32768 x 36-bit FIFO, 10ns | Integrated-Device-Technology-Inc- | TQFP | 128 | 0°C | 70°C | 567 K |
| IDT72V3690L15PF | 3.3V, high-density, low power, 32768 x 36-bit FIFO, 15ns | Integrated-Device-Technology-Inc- | TQFP | 128 | 0°C | 70°C | 567 K |
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