Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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HYS72V32200GU-8 | 100 MHz 32M x 72 1 bank SDRAM module | Infineon-formely-Siemens | - | 168 | 0°C | 70°C | 84 K |
HYS72V64220GU-8 | 100 MHz 64M x 72 2 bank SDRAM module | Infineon-formely-Siemens | - | 168 | 0°C | 70°C | 84 K |
IDT72V01L25J | 3.3V volt CMOS asynchronous FIFO 512 x 9, 1024 x 9, 2048 x 9, 4096 x 9 | Integrated-Device-Technology-Inc- | PLCC | 32 | 0°C | 70°C | 133 K |
IDT72V01L35J | 3.3V volt CMOS asynchronous FIFO 512 x 9, 1024 x 9, 2048 x 9, 4096 x 9 | Integrated-Device-Technology-Inc- | PLCC | 32 | 0°C | 70°C | 133 K |
IDT72V02L25J | 3.3V volt CMOS asynchronous FIFO 512 x 9, 1024 x 9, 2048 x 9, 4096 x 9 | Integrated-Device-Technology-Inc- | PLCC | 32 | 0°C | 70°C | 133 K |
IDT72V02L35J | 3.3V volt CMOS asynchronous FIFO 512 x 9, 1024 x 9, 2048 x 9, 4096 x 9 | Integrated-Device-Technology-Inc- | PLCC | 32 | 0°C | 70°C | 133 K |
IDT72V03L25J | 3.3V volt CMOS asynchronous FIFO 512 x 9, 1024 x 9, 2048 x 9, 4096 x 9 | Integrated-Device-Technology-Inc- | PLCC | 32 | 0°C | 70°C | 133 K |
IDT72V03L35J | 3.3V volt CMOS asynchronous FIFO 512 x 9, 1024 x 9, 2048 x 9, 4096 x 9 | Integrated-Device-Technology-Inc- | PLCC | 32 | 0°C | 70°C | 133 K |
IDT72V04L25J | 3.3V volt CMOS asynchronous FIFO 512 x 9, 1024 x 9, 2048 x 9, 4096 x 9 | Integrated-Device-Technology-Inc- | PLCC | 32 | 0°C | 70°C | 133 K |
IDT72V04L35J | 3.3V volt CMOS asynchronous FIFO 512 x 9, 1024 x 9, 2048 x 9, 4096 x 9 | Integrated-Device-Technology-Inc- | PLCC | 32 | 0°C | 70°C | 133 K |
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