Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
---|
EP7312-CV | High-performance, low-power system on chip with SDRAM and enchanced digital audio interface | Cirrus-Logic | PQFP | 208 | 0°C | 70°C | 2 M |
EP7312-CV-90 | High-performance, low-power system on chip with SDRAM and enchanced digital audio interface | Cirrus-Logic | PQFP | 208 | 0°C | 70°C | 2 M |
KC73129MP | 1/3 inch CCD image sensor for CCIR camera | Samsung-Electronic | PDIP | 16 | -10°C | 55°C | 209 K |
PM73121-RI | AAL1 segmentation and reassembly processor | distributor | QFP | 240 | -40°C | 85°C | 2 M |
PM73122-BI | ATM adaptation layer 1 segmentation and reassembly processor-32 | distributor | SBGA | 352 | -40°C | 85°C | 4 M |
PM73123 | 8 link CES/DBCES AAL1 SAR | distributor | PBGA | 324 | -40°C | 85°C | 55 K |
PM73123-PI | 8 link CES/DBCES ATM adaption layer(AAL1) segmentation | distributor | PBGA | 324 | -40°C | 85°C | 2 M |
PM73124 | 8 link CES/DBCES AAL1 SAR | distributor | PBGA | 324 | -40°C | 85°C | 82 K |
VT73127/D | 27 MHz 3.3V VCXO with output enable | distributor | DIE | - | 0°C | 70°C | 39 K |
VT73127/DW | 27 MHz 3.3V VCXO with output enable | distributor | DIE | - | 0°C | 70°C | 39 K |
[1] 2 [3] [4] [5] |
---|