Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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5962F9475401QLA | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
5962F9475401QLC | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
5962F9475401QLX | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
5962F9475401QXC | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
5962F9475401QXX | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
5962G9475401QLA | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
5962G9475401QLA | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
5962G9475401QLC | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
5962G9475401QLX | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
5962G9475401QXA | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
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