| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| 5962H9657801QRC | RadHard MSI: SMD. Octal D flip-flop w/clear. Class Q, QML. Lead finish gold. Total dose 1E6 rads(Si). | distributor | Ceramic DIP | 20 | -55°C | 125°C | 10 M |
| 5962H9657801QRX | RadHard MSI: SMD. Octal D flip-flop w/clear. Class Q, QML. Lead finish optional. Total dose 1E6 rads(Si). | distributor | Ceramic DIP | 20 | -55°C | 125°C | 10 M |
| 5962H9657801QRX | RadHard MSI: SMD. Octal D flip-flop w/clear. Class Q, QML. Lead finish optional. Total dose 1E6 rads(Si). | distributor | Ceramic DIP | 20 | -55°C | 125°C | 10 M |
| 5962H9657801QRX | RadHard MSI: SMD. Octal D flip-flop w/clear. Class Q, QML. Lead finish optional. Total dose 1E6 rads(Si). | distributor | Ceramic DIP | 20 | -55°C | 125°C | 10 M |
| 5962H9657801VXA | RadHard MSI: SMD. Octal D flip-flop w/clear. Class V, QML. Lead finish solder. Total dose 1E6 rads(Si). | distributor | Ceramic flatpack | 20 | -55°C | 125°C | 10 M |
| 5962H9657801VXA | RadHard MSI: SMD. Octal D flip-flop w/clear. Class V, QML. Lead finish solder. Total dose 1E6 rads(Si). | distributor | Ceramic flatpack | 20 | -55°C | 125°C | 10 M |
| uPD78064BGCA-xxx-3BA | 8-bit single-chip microcontroller, 32K ROM, 1024 RAM, 40x4-bits LCD RAM | NEC-Electronics-Inc- | QFP | 100 | -40°C | 85°C | 396 K |
| uPD78064BGCA-xxx-7EA | 8-bit single-chip microcontroller, 32K ROM, 1024 RAM, 40x4-bits LCD RAM | NEC-Electronics-Inc- | QFP | 100 | -40°C | 85°C | 396 K |
| uPD78064YGC-xxx-7EA | 8-bit single-chip microcontroller, 32K ROM, 1K RAM, 40x4-bits LCD RAM | NEC-Electronics-Inc- | QFP | 100 | -40°C | 85°C | 386 K |
| uPD78064YGF-xxx-3BA | 8-bit single-chip microcontroller, 32K ROM, 1K RAM, 40x4-bits LCD RAM | NEC-Electronics-Inc- | QFP | 100 | -40°C | 85°C | 386 K |
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