| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| A80C188XL12 | 16-bit high-integration embedded processor. 12 MHz | Intel-Corporation | Ceramic PGA | 68 | 0°C | 70°C | 561 K |
| A80C188XL20 | 16-bit high-integration embedded processor. 20 MHz | Intel-Corporation | Ceramic PGA | 68 | 0°C | 70°C | 561 K |
| A80C188XL25 | 16-bit high-integration embedded processor. 25 MHz | Intel-Corporation | Ceramic PGA | 68 | 0°C | 70°C | 561 K |
| TR80C186XL12 | 16-bit high-integration embedded processor. 12 MHz | Intel-Corporation | Ceramic LCC | 68 | -40°C | 85°C | 561 K |
| TR80C186XL20 | 16-bit high-integration embedded processor. 20 MHz | Intel-Corporation | Ceramic LCC | 68 | -40°C | 85°C | 561 K |
| TR80C186XL20 | 16-bit high-integration embedded processor. 20 MHz | Intel-Corporation | Ceramic LCC | 68 | -40°C | 85°C | 561 K |
| TR80C186XL25 | 16-bit high-integration embedded processor. 25 MHz | Intel-Corporation | Ceramic LCC | 68 | -40°C | 85°C | 561 K |
| TR80C186XL25 | 16-bit high-integration embedded processor. 25 MHz | Intel-Corporation | Ceramic LCC | 68 | -40°C | 85°C | 561 K |
| TS80C186XL12 | 16-bit high-integration embedded processor. 12 MHz | Intel-Corporation | QFP | 80 | -40°C | 85°C | 561 K |
| TS80C186XL20 | 16-bit high-integration embedded processor. 20 MHz | Intel-Corporation | QFP | 80 | -40°C | 85°C | 561 K |
| TS80C186XL25 | 16-bit high-integration embedded processor. 25 MHz | Intel-Corporation | QFP | 80 | -40°C | 85°C | 561 K |
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