Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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FX980L6 | TETRA baseband processor | Consumer-Microcircuits-Limited | DIP | 44 | -40°C | 85°C | 821 K |
FX980L7 | TETRA baseband processor | Consumer-Microcircuits-Limited | DIP | 44 | -40°C | 85°C | 821 K |
IDT7201LA80LB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | LCC | 32 | -55°C | 125°C | 152 K |
IDT7202LA80LB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | LCC | 32 | -55°C | 125°C | 152 K |
IDT7203L80LB | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | LCC | 32 | -55°C | 125°C | 147 K |
IDT7203S80LB | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | LCC | 32 | -55°C | 125°C | 147 K |
IDT7204S80LB | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | LCC | 32 | -55°C | 125°C | 147 K |
IDT7280L15PA | CMOS dual asynchronous FIFO dual 256 x 9, dual 512 x 9, dual 1024 x 9 | Integrated-Device-Technology-Inc- | TSSOP | 56 | 0°C | 70°C | 142 K |
IDT7280L20PA | CMOS dual asynchronous FIFO dual 256 x 9, dual 512 x 9, dual 1024 x 9 | Integrated-Device-Technology-Inc- | TSSOP | 56 | 0°C | 70°C | 142 K |
IDT7280L25PA | CMOS dual asynchronous FIFO dual 256 x 9, dual 512 x 9, dual 1024 x 9 | Integrated-Device-Technology-Inc- | TSSOP | 56 | 0°C | 70°C | 142 K |
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