Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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M38200M1-XXXFS | RAM size: 192 bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | LCC | 80 | -20°C | 85°C | 1 M |
M38200M2-XXXFS | RAM size: 192 bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | LCC | 80 | -20°C | 85°C | 1 M |
M38200M3-XXXFS | RAM size: 192 bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | LCC | 80 | -20°C | 85°C | 1 M |
M38200M4-XXXFS | RAM size: 192 bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | LCC | 80 | -20°C | 85°C | 1 M |
M38200M5-XXXFS | RAM size: 192 bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | LCC | 80 | -20°C | 85°C | 1 M |
M38200M7-XXXFS | RAM size: 192 bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | LCC | 80 | -20°C | 85°C | 1 M |
M38200M8-XXXFS | RAM size: 192 bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | LCC | 80 | -20°C | 85°C | 1 M |
T8207-BAL-DB | CelXpres ATM interconnect. Dry pack tray. | distributor | PBGA | 272 | -40°C | 85°C | 4 M |
T8207-BAL-DT | CelXpres ATM interconnect. Dry-bagget, tape & reel . | distributor | PBGA | 272 | -40°C | 85°C | 4 M |
T8208-BAL-DB | CelXpres ATM interconnect. Dry pack tray. | distributor | PBGAM | 272 | -40°C | 85°C | 4 M |
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