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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
M38257E8-XXXGPSingle-chip 8-bit CMOS microcomputer. PROM 32768 bytes, RAM 1024 bytes. One time PROM version.Mitsubishi-Electric-Corporation-Semiconductor-GroupPlastic LQFP100-20°C85°C607 K
M38257E8FSSingle-chip 8-bit CMOS microcomputer. PROM 32768 bytes, RAM 1024 bytes. EPROM version.Mitsubishi-Electric-Corporation-Semiconductor-GroupCeramic QFN100-20°C85°C607 K
M38257E8GPSingle-chip 8-bit CMOS microcomputer. PROM 32768 bytes, RAM 1024 bytes. One time PROM version.Mitsubishi-Electric-Corporation-Semiconductor-GroupPlastic LQFP100-20°C85°C607 K
M38257M8DXXXFPSingle-chip 8-bit CMOS microcomputer. ROM 32768 bytes, RAM 1024 bytes. Mask ROM version.Mitsubishi-Electric-Corporation-Semiconductor-GroupPlastic QFP100-40°C85°C607 K
X88257J256K (32768 x 8bit) E2 Micro-PeripheraldistributorPLCC32320°C70°C70 K
X88257JI256K (32768 x 8bit) E2 Micro-PeripheraldistributorPLCC3232-40°C85°C70 K
X88257JM256K (32768 x 8bit) E2 Micro-PeripheraldistributorPLCC3232-55°C125°C70 K
X88257S256K (32768 x 8bit) E2 Micro-PeripheraldistributorSOIC28P280°C70°C70 K
X88257SI256K (32768 x 8bit) E2 Micro-PeripheraldistributorSOIC28P28-40°C85°C70 K
X88257SM256K (32768 x 8bit) E2 Micro-PeripheraldistributorSOIC28P28-55°C125°C70 K
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