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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
AT28C256-25LM/883256K(32K x 8) paged CMOS EPROMATMEL-CorporationLCC32-55°C125°C762 K
AT28C256-25UM/883256K(32K x 8) paged CMOS EPROMATMEL-CorporationPGA28-55°C125°C762 K
AT28C256-W256K(32K x 8) paged CMOS EPROMATMEL-CorporationDie-0°C70°C762 K
AT28C256E-25LM/883256K(32K x 8) paged CMOS EPROMATMEL-CorporationLCC32-55°C125°C762 K
AT28C256E-25UM/883256K(32K x 8) paged CMOS EPROMATMEL-CorporationPGA28-55°C125°C762 K
AT28C256F-25FM/883256K(32K x 8) paged CMOS EPROMATMEL-CorporationFlatpack28-55°C125°C762 K
AT28C256F-25LM/883256K(32K x 8) paged CMOS EPROMATMEL-CorporationLCC32-55°C125°C762 K
AT28C256F-25UM/883256K(32K x 8) paged CMOS EPROMATMEL-CorporationPGA28-55°C125°C762 K
HN58C256AP-10265K EEPROM (32-kword x 8-bit), 100ns access timedistributorplastic DIP280°C70°C126 K
HN58C256AP-85265K EEPROM (32-kword x 8-bit), 85ns access timedistributorplastic DIP280°C70°C126 K
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