Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
---|
UT8R128K32-15WCA | 128K x 32 SRAM. 15ns access time. Lead finish hot solder dipped. | distributor | Ceramic flatpack | 68 | -55°C | 125°C | 180 K |
UT8R128K32-15WCC | 128K x 32 SRAM. 15ns access time. Lead finish gold. | distributor | Ceramic flatpack | 68 | -55°C | 125°C | 180 K |
UT8R128K32-15WCC | 128K x 32 SRAM. 15ns access time. Lead finish gold. | distributor | Ceramic flatpack | 68 | -55°C | 125°C | 180 K |
UT8R128K32-15WPC | 128K x 32 SRAM. 15ns access time. Lead finish gold. Prototype flow. | distributor | Ceramic flatpack | 68 | - | - | 180 K |
UT8R128K32-15WPC | 128K x 32 SRAM. 15ns access time. Lead finish gold. Prototype flow. | distributor | Ceramic flatpack | 68 | - | - | 180 K |
UT8R128K32-15WPC | 128K x 32 SRAM. 15ns access time. Lead finish gold. Prototype flow. | distributor | Ceramic flatpack | 68 | - | - | 180 K |
UT8R128K32-15WWC | 128K x 32 SRAM. 15ns access time. Lead finish gold. | distributor | Ceramic flatpack | 68 | -40°C | 125°C | 180 K |
UT8R128K32-15WWC | 128K x 32 SRAM. 15ns access time. Lead finish gold. | distributor | Ceramic flatpack | 68 | -40°C | 125°C | 180 K |
UT8R128K32-15WWX | 128K x 32 SRAM. 15ns access time. Lead finish factory option. | distributor | Ceramic flatpack | 68 | -40°C | 125°C | 180 K |
WSF128K32-27H2CA | 5V power supply; 128K x 32 SRAM/flash module | distributor | HIP | 66 | -55°C | 125°C | 223 K |
WSF128K32-29H2C | 5V power supply; 128K x 32 SRAM/flash module | distributor | HIP | 66 | -55°C | 125°C | 223 K |
WSF128K32-29H2CA | 5V power supply; 128K x 32 SRAM/flash module | distributor | HIP | 66 | -55°C | 125°C | 223 K |
<< [142] [143] [144] [145] [146] 147 [148] |
---|