| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| CY7C199-15LMB | 32K x 8 static RAM | Cypress-Semiconductor | LCC | 28 | -55°C | 125°C | 239 K |
| DMF3929-102 | Chip on board mixer quad (to 6 GHz) | distributor | - | - | -55°C | 150°C | 33 K |
| DMF3949-106 | Chip on board mixer quad (to 10 GHz) | distributor | - | - | -55°C | 150°C | 33 K |
| DS1669-10 | Electronic digital rheostat, ~ 10 k. | Dallas-Semiconductor | DIP | 8 | -40°C | 85°C | 151 K |
| G901AO-DC9-1Nil | Relay. Coil voltage 9 VDC. Mounting PCB w/ Top QC. Contact form A. Covering open frame. Spacing UL873. Insulation Std. Class B. | distributor | - | - | -55°C | 85°C | 133 K |
| G90NilAO-DC9-1Nil | Relay. Coil voltage 9 VDC. Mounting PCB. Contact form A. Covering open frame. Spacing UL873. Insulation Std. Class B. | distributor | - | - | -55°C | 85°C | 133 K |
| G90NilBO-DC9-1Nil | Relay. Coil voltage 9 VDC. Mounting PCB. Contact form B. Covering open frame. Spacing UL873. Insulation Std. Class B. | distributor | - | - | -55°C | 85°C | 133 K |
| G90NilCO-DC9-1Nil | Relay. Coil voltage 9 VDC. Mounting PCB. Contact form C. Covering open frame. Spacing UL873. Insulation Std. Class B. | distributor | - | - | -55°C | 85°C | 133 K |
| HY19-12 | 90 degree hybrid 1.85-1.99 GHz | distributor | SOIC | 8 | -40°C | 85°C | 49 K |
| PD09-12 | Two-way 0 power splitter combiner 0.81-0.96 GHz | distributor | SOIC | 8 | -40°C | 85°C | 45 K |
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