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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
689-1D,1N,1PCenter TapMicrosemi-CorporationND---71 K
BD179-10Plastic medium power silicon NPN transistorMotorola-3-65°C150°C106 K
ESJA89-12AHigh voltage silicon diodedistributor-2--134 K
ESJA89-14AHigh voltage silicon diodedistributor-2--137 K
LH5P8129-10CMOS 1M(128K x 8)CS-control pseudo-static RAMSharpDIP320°C70°C119 K
MAC229-10TriacMotorola-4-40°C110°C83 K
MB84VD2009-10MCP (multi-chip package) flash memory & SRAM 8M(x16) flash memory & 2M(x16) static RAMFujitsu-Microelectronisplastic BGA48-20°C85°C393 K
PI6C2309-1HL3.3V zero-delay bufferdistributorTSSOP160°C70°C156 K
PI6C2309-1HW3.3V zero-delay bufferdistributorSOIC160°C70°C156 K
PI6C2309-1W3.3V zero-delay bufferdistributorSOIC160°C70°C156 K
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