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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
5962P9960701TXA512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 3E4(30krad)(Si)distributorFlatpack shielded36-55°C125°C127 K
5962P9960701TXC512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 3E4(30krad)(Si)distributorFlatpack shielded36-55°C125°C127 K
5962P9960702TXA512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 3E4(30krad)(Si)distributorFlatpack shielded36-40°C125°C127 K
5962P9960702TXC512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 3E4(30krad)(Si)distributorFlatpack shielded36-40°C125°C127 K
5962P9960702TXX512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 3E4(30krad)(Si)distributorFlatpack shielded36-40°C125°C127 K
5962P9960703TXC512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 3E4(30krad)(Si)distributorFlatpack shielded36-55°C125°C127 K
5962P9960704TXA512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 3E4(30krad)(Si)distributorFlatpack shielded36-40°C125°C127 K
5962P9960704TXA512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 3E4(30krad)(Si)distributorFlatpack shielded36-40°C125°C127 K
5962P9960704TXC512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 3E4(30krad)(Si)distributorFlatpack shielded36-40°C125°C127 K
5962P9960704TXX512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 3E4(30krad)(Si)distributorFlatpack shielded36-40°C125°C127 K
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