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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
5962-0323601QXX128K x 32 SRAM: SMD. 15ns access time. Class Q. Lead finish factory option.distributorCeramic flatpack68-55°C125°C180 K
5962-0323602QXA128K x 32 SRAM: SMD. 15ns access time. Class Q. Lead finish hot solder dipped.distributorCeramic flatpack68-40°C125°C180 K
5962-0323602QXA128K x 32 SRAM: SMD. 15ns access time. Class Q. Lead finish hot solder dipped.distributorCeramic flatpack68-40°C125°C180 K
5962-0323602QXC128K x 32 SRAM: SMD. 15ns access time. Class Q. Lead finish gold.distributorCeramic flatpack68-40°C125°C180 K
5962-0323602QXX128K x 32 SRAM: SMD. 15ns access time. Class Q. Lead finish factory option.distributorCeramic flatpack68-40°C125°C180 K
5962-0323602VXA128K x 32 SRAM: SMD. 15ns access time. Class V. Lead finish hot solder dipped.distributorCeramic flatpack68-40°C125°C180 K
5962-0323602VXC128K x 32 SRAM: SMD. 15ns access time. Class V. Lead finish gold.distributorCeramic flatpack68-40°C125°C180 K
5962-0323602VXX128K x 32 SRAM: SMD. 15ns access time. Class V. Lead finish factory option.distributorCeramic flatpack68-40°C125°C180 K
5962R-TBD01QTBDA256K x 16 SRAM: SMD. 15ns access time, CMOS I/O. Class Q. Lead finish hot solder dipped. Total dose 100K rad(Si).distributorTBD48-55°C125°C94 K
5962R-TBD01QTBDC256K x 16 SRAM: SMD. 15ns access time, CMOS I/O. Class Q. Lead finish gold. Total dose 100K rad(Si).distributorTBD48-55°C125°C94 K
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