Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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5962-0323601QXX | 128K x 32 SRAM: SMD. 15ns access time. Class Q. Lead finish factory option. | distributor | Ceramic flatpack | 68 | -55°C | 125°C | 180 K |
5962-0323602QXA | 128K x 32 SRAM: SMD. 15ns access time. Class Q. Lead finish hot solder dipped. | distributor | Ceramic flatpack | 68 | -40°C | 125°C | 180 K |
5962-0323602QXA | 128K x 32 SRAM: SMD. 15ns access time. Class Q. Lead finish hot solder dipped. | distributor | Ceramic flatpack | 68 | -40°C | 125°C | 180 K |
5962-0323602QXC | 128K x 32 SRAM: SMD. 15ns access time. Class Q. Lead finish gold. | distributor | Ceramic flatpack | 68 | -40°C | 125°C | 180 K |
5962-0323602QXX | 128K x 32 SRAM: SMD. 15ns access time. Class Q. Lead finish factory option. | distributor | Ceramic flatpack | 68 | -40°C | 125°C | 180 K |
5962-0323602VXA | 128K x 32 SRAM: SMD. 15ns access time. Class V. Lead finish hot solder dipped. | distributor | Ceramic flatpack | 68 | -40°C | 125°C | 180 K |
5962-0323602VXC | 128K x 32 SRAM: SMD. 15ns access time. Class V. Lead finish gold. | distributor | Ceramic flatpack | 68 | -40°C | 125°C | 180 K |
5962-0323602VXX | 128K x 32 SRAM: SMD. 15ns access time. Class V. Lead finish factory option. | distributor | Ceramic flatpack | 68 | -40°C | 125°C | 180 K |
5962R-TBD01QTBDA | 256K x 16 SRAM: SMD. 15ns access time, CMOS I/O. Class Q. Lead finish hot solder dipped. Total dose 100K rad(Si). | distributor | TBD | 48 | -55°C | 125°C | 94 K |
5962R-TBD01QTBDC | 256K x 16 SRAM: SMD. 15ns access time, CMOS I/O. Class Q. Lead finish gold. Total dose 100K rad(Si). | distributor | TBD | 48 | -55°C | 125°C | 94 K |
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