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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
5962D0053601TXA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).distributorFlatpack shielded36-55°C125°C128 K
5962D0053602TXA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).distributorFlatpack shielded36-40°C125°C128 K
5962D0053604TXA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).distributorFlatpack shielded36-40°C125°C128 K
5962D0151101QXC512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class Q. Total dose 1E4(10krad(Si)).distributorCQFP68-40°C125°C135 K
5962D0151101TXC512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class T. Total dose 1E4(10krad(Si)).distributorCQFP68-40°C125°C135 K
5962L0151101QXC512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class Q. Total dose 5E4(50krad(Si)).distributorCQFP68-40°C125°C135 K
5962P0151101QXC512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class Q. Total dose 3E4(30krad(Si)).distributorCQFP68-40°C125°C135 K
5962P0151101QXC512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class Q. Total dose 3E4(30krad(Si)).distributorCQFP68-40°C125°C135 K
5962P0151101TXC512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class T. Total dose 3E4(30krad(Si)).distributorCQFP68-40°C125°C135 K
5962P0151101TXC512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class T. Total dose 3E4(30krad(Si)).distributorCQFP68-40°C125°C135 K
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