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5962D0053601TUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).distributorCeramic flatpack36-55°C125°C128 K
5962D0053601TUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).distributorCeramic flatpack36-55°C125°C128 K
5962D0053601TUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).distributorCeramic flatpack36-55°C125°C128 K
5962D0053601TUC512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 1E4(10krad(Si)).distributorCeramic flatpack36-55°C125°C128 K
5962D0053602TUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).distributorCeramic flatpack36-40°C125°C128 K
5962D0053602TUC512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 1E4(10krad(Si)).distributorCeramic flatpack36-40°C125°C128 K
5962D0053603TUA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).distributorCeramic flatpack36-55°C125°C128 K
5962D0053604TUA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).distributorCeramic flatpack36-40°C125°C128 K
5962D0053604TUA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).distributorCeramic flatpack36-40°C125°C128 K
5962D0053604TUC512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 1E4(10krad(Si)).distributorCeramic flatpack36-40°C125°C128 K
5962D0053604TUC512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 1E4(10krad(Si)).distributorCeramic flatpack36-40°C125°C128 K
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