| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| 5962-8957601XA | Remote terminal with RAM: S. Class QML Q. Lead finish solder. | distributor | PGA | 68 | -55°C | 125°C | 1 M |
| 5962-JM38510/55501BZC | RTI remote terminal interface. 10% to 35% clock duty cycle. Jan class Q. Lead finish gold. | distributor | PGA | 84 | -55°C | 125°C | 1 M |
| 5962-JM38510/55501BZX | RTI remote terminal interface. 10% to 35% clock duty cycle. Jan class Q. Lead finish optional. | distributor | PGA | 84 | -55°C | 125°C | 1 M |
| 5962R9475408QLA | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish solder. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| 5962R9475408QLA | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish solder. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| 5962R9475408QLC | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish gold. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| 5962R9475408QLC | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish gold. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| 5962R9475408QLX | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| 5962R9475408QXX | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
| 5962R9475408QXX | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
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