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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
CY7C1360A-200BGC256K x 36 pipelined SRAM, 200MHzCypress-SemiconductorFBGA1190°C70°C765 K
CY7C1362A-200AC512K x 18 pipelined SRAM, 200MHzCypress-SemiconductorTQFP1000°C70°C765 K
CY7C1362A-200AJC512K x 18 pipelined SRAM, 200MHzCypress-SemiconductorTQFP1000°C70°C765 K
CY7C1362A-200BGC512K x 18 pipelined SRAM, 200MHzCypress-SemiconductorFBGA1190°C70°C765 K
ispLSI1016EA-200LJ44In-system programmable high density PLD, 200 MHz, 4.5ns, low powerLattice-Semiconductor-CorporationPLCC440°C70°C162 K
ispLSI1016EA-200LT44In-system programmable high density PLD, 200 MHz, 4.5ns, low powerLattice-Semiconductor-CorporationTQFP440°C70°C162 K
P4C198A-20DM20 ns,static CMOS RAM, 16 K x 4 ultra high speeddistributorCDIP24-55°C125°C83 K
P4C198A-20DMB20 ns,static CMOS RAM, 16 K x 4 ultra high speeddistributorCDIP24-55°C125°C83 K
P4C198A-20PC20 ns,static CMOS RAM, 16 K x 4 ultra high speeddistributorDIP240°C70°C83 K
P4C198A-20PI20 ns,static CMOS RAM, 16 K x 4 ultra high speeddistributorDIP24-40°C85°C83 K
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