Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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IDT71256SA20PE | CMOS static RAM 256K (32K x 8-bit) in PE packages | Integrated-Device-Technology-Inc- | SOIC | 28 | 0°C | 70°C | 65 K |
IDT71V256SA20PZ | Low power 3.3V CMOS fast SRAM 256K (32 x 8-bit) | Integrated-Device-Technology-Inc- | TSOP | 28 | 0°C | 70°C | 67 K |
IDT71V256SA20TP | Low power 3.3V CMOS fast SRAM 256K (32 x 8-bit) | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 67 K |
IDT71V256SA20Y | Low power 3.3V CMOS fast SRAM 256K (32 x 8-bit) | Integrated-Device-Technology-Inc- | SOJ | 28 | 0°C | 70°C | 67 K |
IDT71V256SA20Y | Low power 3.3V CMOS fast SRAM 256K (32 x 8-bit) | Integrated-Device-Technology-Inc- | SOJ | 28 | 0°C | 70°C | 67 K |
IDT7201LA20XE | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | CERPACK | 28 | 0°C | 70°C | 152 K |
IDT7201LA20XEB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | CERPACK | 28 | -55°C | 125°C | 152 K |
IDT7202LA20XE | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | CERPACK | 28 | 0°C | 70°C | 152 K |
IDT7202LA20XEB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | CERPACK | 28 | -55°C | 125°C | 152 K |
IDT7202LA20XEB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | CERPACK | 28 | -55°C | 125°C | 152 K |
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