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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
IDT7200LA25JCMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9Integrated-Device-Technology-Inc-PLCC320°C70°C152 K
IDT7200LA25SOCMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9Integrated-Device-Technology-Inc-SOIC280°C70°C152 K
IDT7201LA25LCMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9Integrated-Device-Technology-Inc-LCC320°C70°C152 K
IDT7201LA25SOCMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9Integrated-Device-Technology-Inc-SOIC280°C70°C152 K
IDT7201LA25XECMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9Integrated-Device-Technology-Inc-CERPACK280°C70°C152 K
IDT7202LA25JCMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9Integrated-Device-Technology-Inc-PLCC320°C70°C152 K
IDT7202LA25LCMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9Integrated-Device-Technology-Inc-LCC320°C70°C152 K
IDT7202LA25SOCMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9Integrated-Device-Technology-Inc-SOIC280°C70°C152 K
IDT7202LA25TDCMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9Integrated-Device-Technology-Inc-THINDIP280°C70°C152 K
IDT7202LA25XECMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9Integrated-Device-Technology-Inc-CERPACK280°C70°C152 K
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