| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| A80960HA25SL2GX | 32-bit high-performance superscalar processor. Core speed 25 MHz, bus speed 25 MHz | Intel-Corporation | Ceramic PGA | 168 | 0°C | 85°C | 1 M |
| AS6VA25616-BC | 2.7V to 3.3V 256K x 16 Intelliwatt low-power CMOS SRAM with one chip enable | Alliance-Semiconductor-Corporation | CSP BGA | 48 | 0°C | 70°C | 180 K |
| AS6VA25616-BC | 2.7V to 3.3V 256K x 16 Intelliwatt low-power CMOS SRAM with one chip enable | Alliance-Semiconductor-Corporation | CSP BGA | 48 | 0°C | 70°C | 180 K |
| AS6VA25616-BI | 2.7V to 3.3V 256K x 16 Intelliwatt low-power CMOS SRAM with one chip enable | Alliance-Semiconductor-Corporation | CSP BGA | 48 | -40°C | 85°C | 180 K |
| AS6VA25616-TI | 2.7V to 3.3V 256K x 16 Intelliwatt low-power CMOS SRAM with one chip enable | Alliance-Semiconductor-Corporation | TSOPII | 44 | -40°C | 85°C | 180 K |
| AS6WA25616-BC | 3.0V to 3.6V 256K x 16 Intelliwatt low-power CMOS SRAM with one chip enable | Alliance-Semiconductor-Corporation | CSP BGA | 48 | 0°C | 70°C | 180 K |
| AS6WA25616-TC | 3.0V to 3.6V 256K x 16 Intelliwatt low-power CMOS SRAM with one chip enable | Alliance-Semiconductor-Corporation | TSOPII | 44 | 0°C | 70°C | 180 K |
| AS6WA25616-TI | 3.0V to 3.6V 256K x 16 Intelliwatt low-power CMOS SRAM with one chip enable | Alliance-Semiconductor-Corporation | TSOPII | 44 | -40°C | 85°C | 180 K |
| FC80960HA25SL2GU | 32-bit high-performance superscalar processor. Core speed 25 MHz, bus speed 25 MHz | Intel-Corporation | PQFP | 208 | 0°C | 85°C | 1 M |
| PA25A | Power dual operational amplifier | Apex-Microtechnology-Corporation | - | 8 | -55°C | 125°C | 84 K |
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