| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| 24AA65-/P | 64K 1.8V I2C smart EEPROM | Microchip-Technology-Inc- | - | 8 | 0°C | 70°C | 105 K |
| 24AA65-/SM | 64K 1.8V I2C smart EEPROM | Microchip-Technology-Inc- | - | 8 | 0°C | 70°C | 105 K |
| 24AA65T-/P | 64K 1.8V I2C smart EEPROM | Microchip-Technology-Inc- | - | 8 | 0°C | 70°C | 105 K |
| 24AA65T-/P | 64K 1.8V I2C smart EEPROM | Microchip-Technology-Inc- | - | 8 | 0°C | 70°C | 105 K |
| 24AA65T-/SM | 64K 1.8V I2C smart EEPROM | Microchip-Technology-Inc- | - | 8 | 0°C | 70°C | 105 K |
| A6595KA | 8-Bit serial-input,DMOS power driver | Allegro-MicroSystems-Inc- | DIP | 20 | -40°C | 125°C | 167 K |
| A6595KLW | 8-Bit serial-input,DMOS power driver | Allegro-MicroSystems-Inc- | SOIC | 20 | -40°C | 125°C | 167 K |
| IDT7200LA65TPB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | THINDIP | 28 | -55°C | 125°C | 152 K |
| IDT7201LA65PB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | -55°C | 125°C | 152 K |
| IDT7201LA65TPB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | THINDIP | 28 | -55°C | 125°C | 152 K |
| IDT7202LA65TPB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | THINDIP | 28 | -55°C | 125°C | 152 K |
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