Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
---|
A80186 | High-integration 16-bit microprocessor | Intel-Corporation | Ceramic PGA | 68 | 0°C | 70°C | 394 K |
A80188 | High-integration 16-bit microprocessor | Intel-Corporation | Ceramic PGA | 68 | 0°C | 70°C | 394 K |
A80C186XL25 | 16-bit high-integration embedded processor. 25 MHz | Intel-Corporation | Ceramic PGA | 68 | 0°C | 70°C | 561 K |
A80C186XL25 | 16-bit high-integration embedded processor. 25 MHz | Intel-Corporation | Ceramic PGA | 68 | 0°C | 70°C | 561 K |
QA80186 | High-integration 16-bit microprocessor with burn-in | Intel-Corporation | Ceramic PGA | 68 | 0°C | 70°C | 394 K |
QA80188 | High-integration 16-bit microprocessor with burn-in | Intel-Corporation | Ceramic PGA | 68 | 0°C | 70°C | 394 K |
TA80186 | High-integration 16-bit microprocessor | Intel-Corporation | Ceramic PGA | 68 | -40°C | 85°C | 394 K |
TA80188 | High-integration 16-bit microprocessor | Intel-Corporation | Ceramic PGA | 68 | -40°C | 85°C | 394 K |
TA80960CA-16 | 32-Bit high-performance embedded processor | Intel-Corporation | Ceramic PGA | 168 | -40°C | 110°C | 1 M |
TA80960CF-16 | 32-Bit high-performance superscalar processor | Intel-Corporation | Ceramic PGA | 168 | -40°C | 110°C | 1 M |
TA80960CF-25 | 32-Bit high-performance superscalar processor | Intel-Corporation | Ceramic PGA | 168 | -40°C | 110°C | 1 M |
<< [19] [20] [21] [22] [23] 24 [25] [26] [27] [28] [29] >> |
---|