| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| UT54ACTS08PCA | RadHard MSI. Quadruple 2-input AND. TTL compatible I/O level. Lead finish solder. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
| UT54ACTS08PCC | RadHard MSI. Quadruple 2-input AND. TTL compatible I/O level. Lead finish gold. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
| UT54ACTS08PCX | RadHard MSI. Quadruple 2-input AND. TTL compatible I/O level. Lead finish optional. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
| UT54ACTS08PCX | RadHard MSI. Quadruple 2-input AND. TTL compatible I/O level. Lead finish optional. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
| UT54ACTS08UCC | RadHard MSI. Quadruple 2-input AND. TTL compatible I/O level. Lead finish gold. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
| UT54ACTS08UCX | RadHard MSI. Quadruple 2-input AND. TTL compatible I/O level. Lead finish optional. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
| UT54ACTS10PCA | RadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish solder. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
| UT54ACTS10PCA | RadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish solder. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
| UT54ACTS10UCC | RadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish gold. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
| UT54ACTS10UCC | RadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish gold. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
| UT54ACTS10UCX | RadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish optional. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
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