Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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CXK58257AP-10L | 32768-word x 8-bit high speed CMOS static RAM, 100ns, standby 2.5uW | Sony-Semiconductor | DIP | 28 | 0°C | 70°C | 291 K |
CXK58257AP-12L | 32768-word x 8-bit high speed CMOS static RAM, 120ns, standby 2.5uW | Sony-Semiconductor | DIP | 28 | 0°C | 70°C | 291 K |
HM6264AP-10 | 8192-word x 8-bit high speed CMOS static RAM, 100ns | distributor | PDIP | 28 | 0°C | 70°C | 54 K |
HM6264AP-12 | 8192-word x 8-bit high speed CMOS static RAM, 120ns | distributor | PDIP | 28 | 0°C | 70°C | 54 K |
JK1aP-12V | JK-relay. Slim type power relay. 1 form A. Coil voltage 12 V DC. Sealed type. High capacity (8A). | distributor | - | 4 | -40°C | 70°C | 51 K |
JK1aP-18V | JK-relay. Slim type power relay. 1 form A. Coil voltage 18 V DC. Sealed type. High capacity (8A). | distributor | - | 4 | -40°C | 70°C | 51 K |
JQ1aP-12V | JQ-relay. High electrical and mechanical noise immunity relay. 1 form A. Coil voltage 12 V DC. High contact capacity. Class E coil insulation. | distributor | - | 4 | -40°C | 85°C | 107 K |
PEEL22CV10AP-10 | 10ns CMOS programmable electrically erasable logic device | distributor | PDIP | 20 | 0°C | 70°C | 247 K |
PEEL22CV10AP-15 | 15ns CMOS programmable electrically erasable logic device | distributor | PDIP | 20 | 0°C | 70°C | 247 K |
W29C011AP-15 | 128K x 8 CMOS flash memory, 150ns | Winbond-Electronics | PLCC | 32 | 0°C | 70°C | 153 K |
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