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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
28C256ASC-1High speed CMOS. 256K electrically erasable programmable ROM. 32K x 8 bit EEPROM. Access time 120 ns.distributorSOIC280°C70°C41 K
28C256ASC-2High speed CMOS. 256K electrically erasable programmable ROM. 32K x 8 bit EEPROM. Access time 150 ns.distributorSOIC280°C70°C41 K
28C256ASC-3High speed CMOS. 256K electrically erasable programmable ROM. 32K x 8 bit EEPROM. Access time 200 ns.distributorSOIC280°C70°C41 K
28C256ASC-4High speed CMOS. 256K electrically erasable programmable ROM. 32K x 8 bit EEPROM. Access time 250 ns.distributorSOIC280°C70°C41 K
28C64ASC-1High speed CMOS. 64K electrically erasable programmable ROM. 8K x 8 bit EEPROM. Access time 120 ns.distributorSOIC280°C70°C42 K
28C64ASC-2High speed CMOS. 64K electrically erasable programmable ROM. 8K x 8 bit EEPROM. Access time 150 ns.distributorSOIC280°C70°C42 K
28C64ASC-3High speed CMOS. 64K electrically erasable programmable ROM. 8K x 8 bit EEPROM. Access time 200 ns.distributorSOIC280°C70°C42 K
28C64ASC-4High speed CMOS. 64K electrically erasable programmable ROM. 8K x 8 bit EEPROM. Access time 250 ns.distributorSOIC280°C70°C42 K
AD536ASCHIPS18V; 500mW; integrated circuit true RMS-to-DC converterAnalog-DevicesDie10-55°C125°C165 K
G83ASC-DC48-KRelay. Coil voltage 48 VDC. Contact form: 1 form A. Sealed. Contact material AgCdO. Sensitive.distributor---30°C60°C53 K
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