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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
AT28HC256E-12DM/883256(32K x 8) high speed CMOS EPROMATMEL-Corporationceramic DIP28-55°C125°C728 K
AT28HC256E-12FM/883256(32K x 8) high speed CMOS EPROMATMEL-CorporationFlatpack28-55°C125°C728 K
AT28HC256E-12TI256(32K x 8) high speed CMOS EPROMATMEL-CorporationTSOP28-40°C85°C728 K
AT28HC256E-12UM/883256(32K x 8) high speed CMOS EPROMATMEL-CorporationPGA28-55°C125°C728 K
AT28HC256F-12JC256(32K x 8) high speed CMOS EPROMATMEL-CorporationPLCC320°C70°C728 K
AT28HC256F-12JI256(32K x 8) high speed CMOS EPROMATMEL-CorporationPLCC32-40°C85°C728 K
AT28HC256F-12PC256(32K x 8) high speed CMOS EPROMATMEL-CorporationPDIP280°C70°C728 K
AT28HC256F-12PI256(32K x 8) high speed CMOS EPROMATMEL-CorporationPDIP28-40°C85°C728 K
AT28HC256F-12TC256(32K x 8) high speed CMOS EPROMATMEL-CorporationTSOP280°C70°C728 K
AT28HC256F-12TI256(32K x 8) high speed CMOS EPROMATMEL-CorporationTSOP28-40°C85°C728 K
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