Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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DB151 | 1.5A single-phase silicon bridge rectifier | distributor | - | 4 | -65°C | 150°C | 377 K |
DB152 | 1.5A single-phase silicon bridge rectifier | distributor | - | 4 | -65°C | 150°C | 377 K |
DB153 | 1.5A single-phase silicon bridge rectifier | distributor | - | 4 | -65°C | 150°C | 377 K |
DE28F800F3B150 | Fast boot block flash memory 8 Mbit. Access speed 150 ns | Intel-Corporation | SSOP | 56 | -40°C | 125°C | 277 K |
GT28F008B3-B150 | Smart 3 advanced boot block byte-wide flash memory 8 Mbit. Access speed 150 ns | Intel-Corporation | microBGA | 48 | -40°C | 85°C | 408 K |
GT28F016B3-B150 | Smart 3 advanced boot block byte-wide flash memory 16 Mbit. Access speed 150 ns | Intel-Corporation | microBGA | 48 | -40°C | 85°C | 408 K |
GT28F400B3-B150 | Smart 3 advanced boot block 4-Mbit (256K x 16) flash memory. Access speed 150 ns | Intel-Corporation | microBGA | 48 | -40°C | 85°C | 427 K |
TE28F008B3-B150 | Smart 3 advanced boot block byte-wide flash memory 8 Mbit. Access speed 150 ns | Intel-Corporation | TSOP | 40 | -40°C | 85°C | 408 K |
TE28F008B3-B150 | Smart 3 advanced boot block byte-wide flash memory 8 Mbit. Access speed 150 ns | Intel-Corporation | TSOP | 40 | -40°C | 85°C | 408 K |
TE28F016B3-B150 | Smart 3 advanced boot block byte-wide flash memory 16 Mbit. Access speed 150 ns | Intel-Corporation | TSOP | 40 | -40°C | 85°C | 408 K |
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