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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
M38860EBAFSRAM size: 192bytes; single-chip 8-bit CMOS microcomputerMitsubishi-Electric-Corporation-Semiconductor-GroupLCC80-20°C85°C1 M
M38860FBAFSRAM size: 192bytes; single-chip 8-bit CMOS microcomputerMitsubishi-Electric-Corporation-Semiconductor-GroupLCC80-20°C85°C1 M
M38860FBAFSRAM size: 192bytes; single-chip 8-bit CMOS microcomputerMitsubishi-Electric-Corporation-Semiconductor-GroupLCC80-20°C85°C1 M
M38861EBAFSRAM size: 256bytes; single-chip 8-bit CMOS microcomputerMitsubishi-Electric-Corporation-Semiconductor-GroupLCC80-20°C85°C1 M
M38861FBAFSRAM size: 256bytes; single-chip 8-bit CMOS microcomputerMitsubishi-Electric-Corporation-Semiconductor-GroupLCC80-20°C85°C1 M
M38862EBAFSRAM size: 384bytes; single-chip 8-bit CMOS microcomputerMitsubishi-Electric-Corporation-Semiconductor-GroupLCC80-20°C85°C1 M
MH64S72BAFA-72415919104-bit (33554432-word by 72-bit) synchronous dynamic DRAMMitsubishi-Electric-Corporation-Semiconductor-GroupTSOP1680°C70°C778 K
MH64S72BAFA-82415919104-bit (33554432-word by 72-bit) synchronous dynamic DRAMMitsubishi-Electric-Corporation-Semiconductor-GroupTSOP1680°C70°C778 K
MH8S72BAFD-7603979776-bit synchronous DRAMMitsubishi-Electric-Corporation-Semiconductor-GroupTSOP1680°C70°C732 K
MH8S72BAFD-8603979776-bit synchronous DRAMMitsubishi-Electric-Corporation-Semiconductor-GroupTSOP1680°C70°C732 K
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