Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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GS832272C-200 | 200MHz 7.5ns 1M x 36 36Mb SCD/DCD pipelined/flow through SRAM | distributor | BGA | 209 | 0°C | 70°C | 1 M |
GS8322Z18C-200I | 200MHz 7.5ns 2M x 18 36Mb NBT pipelined/flow through SRAM | distributor | BGA | 209 | -40°C | 85°C | 1 M |
GS8322Z36C-200 | 200MHz 7.5ns 1M x 36 36Mb NBT pipelined/flow through SRAM | distributor | BGA | 209 | 0°C | 70°C | 1 M |
GS8322Z36C-200I | 200MHz 7.5ns 1M x 36 36Mb NBT pipelined/flow through SRAM | distributor | BGA | 209 | -40°C | 85°C | 1 M |
GS8322Z72C-200 | 200MHz 7.5ns 1M x 36 36Mb NBT pipelined/flow through SRAM | distributor | BGA | 209 | 0°C | 70°C | 1 M |
GS8322Z72C-200I | 200MHz 7.5ns 1M x 36 36Mb NBT pipelined/flow through SRAM | distributor | BGA | 209 | -40°C | 85°C | 1 M |
GS832418C-200 | 200MHz 7.5ns 2M x 18 36Mb S/DCD sync burst SRAM | distributor | BGA | 209 | 0°C | 70°C | 1 M |
GS832418C-200I | 200MHz 7.5ns 2M x 18 36Mb S/DCD sync burst SRAM | distributor | BGA | 209 | -40°C | 85°C | 1 M |
GS832472C-200 | 200MHz 7.5ns 1M x 36 36Mb SCD/DCD pipeline/flow through SRAM | distributor | BGA | 209 | 0°C | 70°C | 1 M |
GS832472C-200I | 200MHz 7.5ns 1M x 36 36Mb SCD/DCD pipeline/flow through SRAM | distributor | BGA | 209 | -40°C | 85°C | 1 M |
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