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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
LC-25Magnetic contact.distributor---20°C60°C38 K
UT22VP10C-25UCCRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish gold.distributorFlatPack24-55°C125°C287 K
UT22VP10C-25WCARadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish solder.distributorQuad flatpack28-55°C125°C287 K
UT22VP10C-25WCCRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish gold.distributorQuad flatpack28-55°C125°C287 K
UT22VP10C-25WCXRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional.distributorQuad flatpack28-55°C125°C287 K
UT22VP10C-25WCXRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional.distributorQuad flatpack28-55°C125°C287 K
WPS512K8C-25RJIB512K x 8 SRAM, 25nsdistributorSOJ36-40°C85°C204 K
WPS512K8C-25RJM512K x 8 SRAM, 25nsdistributorSOJ36-55°C125°C204 K
WPS512K8C-25RJMB512K x 8 SRAM, 25nsdistributorSOJ36-55°C125°C204 K
WPS512K8LC-25RJI512K x 8 SRAM, low power, 25nsdistributorSOJ36-40°C85°C204 K
WPS512K8LC-25RJI512K x 8 SRAM, low power, 25nsdistributorSOJ36-40°C85°C204 K
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