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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
UT22VP10C-25PCARadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish solder.distributorDIP24-55°C125°C287 K
UT22VP10C-25PCCRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish gold.distributorDIP24-55°C125°C287 K
UT22VP10C-25PCCRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish gold.distributorDIP24-55°C125°C287 K
UT22VP10C-25PCXRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional.distributorDIP24-55°C125°C287 K
UT22VP10C-25PCXRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional.distributorDIP24-55°C125°C287 K
UT22VP10C-25PPARadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder.distributorDIP24--287 K
UT22VP10C-25PPCRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish gold.distributorDIP24--287 K
UT22VP10C-25UCXRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional.distributorFlatPack24-55°C125°C287 K
UT22VP10C-25UPARadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder.distributorFlatPack24--287 K
UT22VP10C-25UPCRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish gold.distributorFlatPack24--287 K
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